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INTEGRATED CIRCUITS
DATA SHEET
TDA8725T Antenna signal processor
Product specification File under Integrated Circuits, IC02 1995 Mar 21
Philips Semiconductors
Philips Semiconductors
Product specification
Antenna signal processor
FEATURES * 75 antenna input stage * 75 VCR RF input stage * 75 VCR tuner output * 75 TV tuner output. GENERAL DESCRIPTION The TDA8725T has been designed to split and combine RF signals for Picture-In-Picture (PIP) and VCR applications. QUICK REFERENCE DATA SYMBOL VP IP fi Gp PARAMETER supply voltage (pins 8 and 9) supply current (pins 8 and 9) input frequency power gain from antenna to VCR from antenna to TV from VCR F IP2 IP3 ssup noise figure antenna linearity 2nd order intercept point antenna linearity 3rd order intercept point signal suppression VCR input to antenna VCR output to TV output TV output to VCR output VSWR voltage standing wave ratio at the antenna input at the outputs Pi(max) maximum input power on antenna for 1 dB gain compression - - - 2.5 1.5 -10 0 to 1 GHz 1 to 3 GHz 0 to 300 MHz 300 to 860 MHz 0 to 300 MHz 300 to 860 MHz 32 25 35 22 35 22 37 30 40 27 40 27 at 40 MHz at 860 MHz at 40 MHz at 860 MHz 3.5 4 - 6.5 137 119 121 108 5.0 5.5 0 9.0 140 124 124 111 CONDITIONS - 40 MIN. 4.75 TYP. 5.0 65 -
TDA8725T
For PIP applications, the antenna input signal is split and fed to the main TV tuner and the PIP tuner. Good signal suppression between the two outputs enables good quality of the main picture when the PIP tuner is in use. For VCR applications, the antenna input signal is split and then fed directly to the VCR tuner and the TV tuner after being combined with the VCR - RF signal. Good signal suppression between the two outputs enables good quality pictures when the TV and VCR tuners are both operating. Good signal suppression between the VCR input and the antenna input reduces the amount of unwanted signal on the antenna.
MAX. 5.25 - 860 6.5 7 - 10 - - - - - - - - - - 4 3 - V
UNIT mA MHz dB dB dB dB dBV dBV dBV dBV dB dB dB dB dB dB
dBm
1995 Mar 21
2
Philips Semiconductors
Product specification
Antenna signal processor
ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA8725T BLOCK DIAGRAM SO16 DESCRIPTION plastic small outline package; 16 leads; body width 3.9 mm
TDA8725T
VERSION SOT109-1
(1)
(2)
(1) TV tuner or main tuner. (2) VCR tuner or PIP tuner.
Fig.1 Block diagram.
1995 Mar 21
3
Philips Semiconductors
Product specification
Antenna signal processor
PINNING SYMBOL TVOUT AAGND1 AAGND2 AAGND3 ANTIN n.c. AAGND4 VP1 VP2 n.c. VCROUT VCRGND1 VCRGND2 VCRIN TVGND1 TVGND2 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DESCRIPTION output to TV tuner (VCR+TV) and to main tuner (PIP) antenna amplifier ground 1 antenna amplifier ground 2 antenna amplifier ground 3 antenna input not connected antenna amplifier ground 4 power supply for the antenna amplifier power supply for the VCR output amplifier not connected output to VCR and PIP tuner VCR amplifier ground 1 VCR amplifier ground 2 VCR RF input TV amplifier ground 1 TV amplifier ground 2
TDA8725T
Fig.2 Pin configuration.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VP Tstg Tamb Tj Ves PARAMETER supply voltage storage temperature operating ambient temperature junction temperature electrostatic handling note 1 note 2 Notes 1. Human Body Model: UZW-BO/FQ-A302 (R = 1500 , C = 100 pF). The IC withstands the ESD test class 2 (2000 V). 2. Machine Model: UZW-BO/FQ-B302 (R = 0 , C = 200 pF). All pins withstand 200 V. THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient in free air VALUE 115 UNIT K/W CONDITIONS MIN. -0.3 -55 -10 - -2000 -200 6 +150 +80 +150 +2000 +200 MAX. V C C C V V UNIT
1995 Mar 21
4
Philips Semiconductors
Product specification
Antenna signal processor
CHARACTERISTICS VP = 5 V; Tamb = 25 C; measured in circuit of Fig.4; unless otherwise specified. SYMBOL VP IP fi Gp PARAMETER supply voltage (pins 8 and 9) supply current (pins 8 and 9) input frequency power gain from antenna to VCR from antenna to TV from VCR F IP2 IP3 ssup noise figure antenna linearity 2nd order intercept point antenna linearity 3rd order intercept point signal suppression VCR input to antenna VCR output to TV output TV output to VCR output VSWR voltage standing wave ratio at the antenna input at the outputs Pi(max) maximum input power on antenna for 1 dB gain compression - - - 2.5 1.5 -10 0 to 1 GHz 1 to 3 GHz 0 to 300 MHz 300 to 860 MHz 0 to 300 MHz 300 to 860 MHz 32 25 35 22 35 22 37 30 40 27 40 27 at 40 MHz at 860 MHz at 40 MHz at 860 MHz 40 to 860 MHz 3.5 4 - 6.5 137 119 121 108 5.0 5.5 0 9.0 140 124 124 111 CONDITIONS MIN. 4.75 55 40 TYP. 5.0 65 -
TDA8725T
MAX. 5.25 75 860 6.5 7 - 10 - - - - - - - - - - 4 3 - V
UNIT mA MHz dB dB dB dB dBV dBV dBV dBV dB dB dB dB dB dB
dBm
1995 Mar 21
5
Philips Semiconductors
Product specification
Antenna signal processor
TDA8725T
Fig.3 Reflection coefficient (S11) antenna input.
1995 Mar 21
6
Philips Semiconductors
Product specification
Antenna signal processor
APPLICATION INFORMATION
TDA8725T
Fig.4 Picture-in-picture (PIP) application.
1995 Mar 21
7
Philips Semiconductors
Product specification
Antenna signal processor
TDA8725T
Fig.5 VCR and TV application.
1995 Mar 21
8
Philips Semiconductors
Product specification
Antenna signal processor
PACKAGE OUTLINE SO16: plastic small outline package; 16 leads; body width 3.9 mm
TDA8725T
SOT109-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 A1 pin 1 index Lp 1 e bp 8 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 0.24 0.23 L 1.05 0.041 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
0.0098 0.057 0.069 0.0039 0.049
0.019 0.0098 0.39 0.014 0.0075 0.38
0.028 0.004 0.012
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07S JEDEC MS-012AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 91-08-13 95-01-23
1995 Mar 21
9
Philips Semiconductors
Product specification
Antenna signal processor
SOLDERING Plastic small-outline packages BY WAVE During placement and before soldering, the component must be fixed with a droplet of adhesive. After curing the adhesive, the component can be soldered. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder bath is 10 s, if allowed to cool to less than 150 C within 6 s. Typical dwell time is 4 s at 250 C. A modified wave soldering technique is recommended using two solder waves (dual-wave), in which a turbulent wave with high upward pressure is followed by a smooth laminar wave. Using a mildly-activated flux eliminates the need for removal of corrosive residues in most applications. BY SOLDER PASTE REFLOW Reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the substrate by screen printing, stencilling or pressure-syringe dispensing before device placement. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8725T
Several techniques exist for reflowing; for example, thermal conduction by heated belt, infrared, and vapour-phase reflow. Dwell times vary between 50 and 300 s according to method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 min at 45 C. REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
IRON OR PULSE-HEATED SOLDER TOOL)
Fix the component by first soldering two, diagonally opposite, end pins. Apply the heating tool to the flat part of the pin only. Contact time must be limited to 10 s at up to 300 C. When using proper tools, all other pins can be soldered in one operation within 2 to 5 s at between 270 and 320 C. (Pulse-heated soldering is not recommended for SO packages.) For pulse-heated solder tool (resistance) soldering of VSO packages, solder is applied to the substrate by dipping or by an extra thick tin/lead plating before package placement.
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1995 Mar 21
10

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